Product specifications| Interface | eMMC 5.0 / eMMC 5.1 |
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| Dimensions | 11.50 × 13.00 mm, 7.50 × 8.00 mm, 7.5 × 12.50 mm, 9.00×10.00 mm |
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| Max. Sequential Read | 300 MB/s |
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| Max. Sequential Write | 240 MB/s |
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| Frequency | / |
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| Capacity | 4 GB - 256 GB |
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| Working Voltage | VCC=3.3 V, VCCQ=1.8 V |
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| Working Temperature | Consumer Grade: -20℃ - 85℃
Industrial Grade: -40℃ - 85℃ |
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| Approved Verification Platforms | Spreadtrum: 7731E, 9832E, 9820E, SC9850K, SC9853I, SC9830...
Qualcomm: 8909, MSM8053...
MediaTek: MT6580, MT6735, MT6737, MT6739, MT6761...
HiSilicon: Hi3798MV300…
Rockchip: RK3128, RK3228, RK3229, RK3328... |
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| Packaging | FBGA153 |
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| Application | In-vehicle / Notebook / Smart Phone / Surveillance |
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Product specifications| Interface | UFS 2.1 / UFS 2.1 / UFS 3.1 |
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| Dimensions | 11.50 × 13.00 mm |
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| Max. Sequential Read | UFS 2.1: 500 MB/s
UFS 2.1: 500 MB/s
UFS 3.1: 1200 MB/s |
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| Max. Sequential Write | UFS 2.1: 856 MB/s
UFS 2.1: 856 MB/s
UFS 3.1: 300 MB/s |
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| Frequency | / |
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| Capacity | UFS 2.1: 128 GB - 256 GB
UFS 2.1: 128 GB - 256 GB
UFS 3.1: 128GB - 512GB |
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| Working Voltage | UFS 2.1: VCC=3.3 V, VCCQ=1.8 V
UFS 2.1: VCC=3.3 V, VCCQ=1.8 V
UFS 3.1: VCC=3.3 V, VCCQ=1.2 V / 1.8 V |
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| Working Temperature | -20℃ - 85℃ |
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| Approved Verification Platforms | UFS 2.1: Qualcomm: 835, 845...
UFS 2.1: Qualcomm: 835, 845…
UFS 3.1: Qualcomm, MediaTek... |
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| Packaging | FBGA153 |
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| Application | Notebook / Smart Phone |
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Product specifications| Interface | LPDDR 2
LPDDR 3
LPDDR 4 / LPDDR 4x
LPDDR 5 / LPDDR 5x |
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| Capacity | LPDDR 2: 2 Gb - 8 Gb
LPDDR 3: 4 Gb - 16 Gb
LPDDR 4 / LPDDR 4x: 4 Gb - 48 Gb
LPDDR 5 / LPDDR 5x: 16 Gb - 64 Gb |
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| Frequency | LPDDR 2: 533 MHz
LPDDR 3: 933 MHz
LPDDR 4 / LPDDR 4x: 1866 MHz
LPDDR 5 / LPDDR 5x: 3200 MHz |
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| Working Voltage | LPDDR 2 / LPDDR 3: VDD1=1.8 V, VDD2=1.2 V, VDDCA=1.2 V, VDDQ=1.2 V
LPDDR 4: VDD1=1.8 V, VDD2=1.1 V, VDDQ=1.1 V, LPDDR 4x: VDDQ=0.6 V
LPDDR 5 / LPDDR 5x: VDD1=1.70-1.95 V, 1.8 V NOM, VDD2H=1.01-1.12 V, 1.05 V NOM, VDD2L=VDD2H or 0.87-0.97 V |
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| Approved Verification Platforms | Spreadtrum: 7731E, 9832E, 9820E, SC9850K...
Qualcomm: 8909...
MediaTek: MT6580, MT6735, MT6737…
HiSilicon: Hi3798MV310…
Allwinner: B288, A50, B300…
Rockchip: RK3128, RK3228, RK3229...
Amlogic: S905X, S905Y2…
Mstar: MSO9385… |
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| Working Temperature | -20℃ - 85℃ |
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| Dimensions | LPDDR 2: 12.00 × 12.00 mm
LPDDR 3: 11.50 × 11.00 mm
LPDDR 4: 11.00 × 14.50 mm
LPDDR 4x: 11.50 × 13.00 mm
LPDDR 5 / LPDDR 5x: 12.40 × 15.00 mm |
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| Packaging | FBGA168 / FBGA178 / FBGA200 / FBGA315 |
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| Application | Smart Phone |
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