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Biwin UFS

Biwin UFS
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UFS

As a next-generation embedded memory chip, the BIWIN UFS chip is three times faster than the latest eMMC 5.1 standard. In addition, UFS 2.1's faster performance could effectively ensure the safe transmission of data without unnecessary lag caused by reading and writing operations, which is the key to the higher speed achieved in UFS 2.1. In addition to its huge advantages in transfer speed, BIWIN UFS 2.1 also has excellent power consumption characteristics.

Product specifications
InterfaceUFS 2.1 / UFS 2.1 / UFS 3.1
Dimensions11.50 × 13.00 mm
Max. Sequential ReadUFS 2.1: 500 MB/s
UFS 2.1: 500 MB/s
UFS 3.1: 1200 MB/s
Max. Sequential WriteUFS 2.1: 856 MB/s
UFS 2.1: 856 MB/s
UFS 3.1: 300 MB/s
Frequency/
CapacityUFS 2.1: 128 GB - 256 GB
UFS 2.1: 128 GB - 256 GB
UFS 3.1: 128GB - 512GB
Working VoltageUFS 2.1: VCC=3.3 V, VCCQ=1.8 V
UFS 2.1: VCC=3.3 V, VCCQ=1.8 V
UFS 3.1: VCC=3.3 V, VCCQ=1.2 V / 1.8 V
Working Temperature-20℃ - 85℃
Approved Verification PlatformsUFS 2.1: Qualcomm: 835, 845...
UFS 2.1: Qualcomm: 835, 845…
UFS 3.1: Qualcomm, MediaTek...
PackagingFBGA153
ApplicationNotebook / Smart Phone
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