YMTC UFS

Our next-generation embedded YMTC UC234 UFS2.2 chip features upgraded hardware and software compared to the original YMTC UFS2.2 chip. UC234 is powered by YMTC’s Gen3 3D NAND flash memory which markedly boosts read and write speeds while enhancing energy efficiency, and includes both JEDEC UFS 2.2 and Host Initiated Defragment (HID) technologies. Designed to be used in mobile phones, tablets, Chromebooks, smart appliances, set top boxes, and other electronic devices; UC234 provides a wide variety of users with better storage solutions.

UC023 is YMTC’s high-speed embedded UFS chip, based on Xtacking® 2.0 TLC 3D NAND Technology, and compatible with JEDEC's latest protocol, UFS 3.1. Featuring high performance and low power consumption, this product is designed exclusively for midrange to premium flagship mobile phones, tablets and other intelligent devices, fulfilling the 5G era's demands for ultra-fast flash memory and processing.

The UC341 is YMTC’s new embedded storage product, fully compliant with the JEDEC UFS 3.1 standard. It leverages YMTC’s Xtacking 3.0 architecture, featuring advanced TLC 3D NAND technology for industry-leading performance with low power consumption, and exceptional reliability. Equipped with innovative technologies such as Multi-Level Autonomous Optimization (Hint HID) and Trace Logging (Trace Dump), the UC341 is available in 128GB, 256GB, and 512GB capacities, making it an ideal solution for flagship smartphones, high-end laptops, VR/AR devices, and other AIoT applications.